Ansys divest requirements; SIA Factbook; McKinsey effects of tariffs; ASE's fan-out bridge; earnings; TSMC's design center; ...

A new technical paper titled “Power Consumption Optimization of GPU Server With Offline Reinforcement Learning” was published ...

A technical paper titled “Enhancing Test Efficiency through Automated ATPG-Aware Lightweight Scan Instrumentation” was ...

A new technical paper titled “Josephson Junctions in the Age of Quantum Discovery” was published by researchers at Lawrence ...

Addressing stress-related issues early in the design cycle through a process of chip-package co-design and co-optimization.

Problems and solutions for improving performance with more data. Demand for new and better AI models is creating an ...

How much value does DAC really add to the industry? Large EDA companies may be ignoring some of the benefits.

Die cracking, solder joint fatigue, warpage, and delamination are just a few of the possible mechanical failures.

Plan for multiple complementary verification methodologies for different levels of processor integration. With the explosive ...

In the past, simulation was the only tool available for verification, but today there are many. Balancing the costs and ...

As AI applications rapidly advance, AI models are being tasked with processing massive amounts of data containing billions – or even trillions – of parameters. Each large workload involves numerous ...

Pros and cons of replacing copper with optical in data-intensive AI systems.