New TPU; TSMC revenue, export investigation; global semi equipment sales; 2D materials roadmap; acquisitions; UALink spec; EU ...

IC ecosystem; UPF 4.0; AI readiness; auto, industrial chiplet SW; PCIe 6; 3D thermal analysis; rad-hard simulation.

Controlling film thickness to precise specifications is essential for ensuring high yield in high-performance devices.

The AI Readiness Index Report provides a valuable benchmark against which organizations can measure their AI maturity. For ...

Boot-up and software deployment in distributed, synchronized multi-processor systems that integrate additional accelerators.

PCIe 6, released in January 2022, introduced a data transfer rate of 64 GT/s (gigatransfers per second), double that of its ...

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on ...

Activation functions play a critical role in AI inference, helping to ferret out nonlinear behaviors in AI models. This makes ...

The impact of embedded micro-bumps and wafer-to-wafer hybrid bonding on the thermal behavior of the package stack.

Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...

Maintaining the quality and reliability of electrical signals as they travel through interconnects is proving to be much more challenging with chiplets and advanced packaging than in monolithic SoCs ...

Key applications for GenAI and the features they enable, as well as an examination of how model growth and differing model ...