EPC’s first seventh-generation eGaN® device enters mass production, delivering up to 3× better performance than silicon ...
EPC’s first Gen 7 eGaN power transistor, the 40-V EPC2366, delivers up to 3× better performance than equivalent silicon ...
ZHUHAI, GUANGDONG, CHINA, January 21, 2026 /EINPresswire.com/ -- Environmental responsibility has transitioned from ...
All of this is prompting chip designers to explore new strategies to dial down the heat. These include using exotic materials like graphene and diamond, incorporating advanced packaging techniques ...
For decades, optical inspection has been the primary method for process control in fabs. However, the move to multi-level ...
Efficient Power Conversion (EPC) has begun volume production of the EPC2366, marking the commercial launch of the company’s ...
Intel's 18A process is built around the Backside Power Delivery Network, or BSPDN, a structural overhaul known inside Intel as PowerVia. Instead of routing power through ...
Reliability is now a system-level concern that includes everything from materials and packaging to testing with backside power.
While Qualcomm's 2nm semiconductor fabrication will happen overseas, the design work highlights India's expanding role in ...
MSI has revealed a limited-run GeForce RTX 5090 Lightning Z that targets high-power operation with an integrated 360 mm AIO liquid cooling solution. The design pairs a full-cover coldplate with a 360 ...
What if a palm-sized amp could outperform larger, more expensive modules while delivering serious sound quality? Check out ...
When that training moves into consumer electronics, the results feel subtle but real. Devices get smaller. Parts fit tighter.
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