SAN DIEGO--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital ...

SANTEE, Calif.--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, will reveal its newest molded ceramic ...

SANTEE, Calif., April 10, 2025--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, announces that it will ...

StratEdge Corporation, a leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-power devices, will showcase its thermally efficient ...

San Diego—StratEdge has introduced a family of small outline thermally enhanced molded ceramic packages for power semiconductors. The new line of packages can be used for silicon, silicon carbide, ...

The conventional flip chip ball grid array (FCBGA) package platform has wide industry usage and provides high electrical performance. However, as high performance requirements increased, it encounters ...

RF power requirements for commercial wireless applications have evolved dramatically over the past few decades. Today, basestation manufacturers demand power ICs capable of offering higher linearity ...

SAN DIEGO--(BUSINESS WIRE)--lt;a href="https://twitter.com/hashtag/APEC?src=hash" target="_blank"gt;#APEClt;/agt;--StratEdge ...