The new funding will help CoolSem Technologies advance its wafer-level thermal management technology, improving heat efficiency, extending chip lifetimes, and enabling more sustainable performance in ...

Recently, that number has risen to five, and while it adds far more flexibility for structuring electronic equipment, it also ...

Device design begins with the anticipated workload. What is it actually supposed to do? What resources — computational units, memory, sensors — are available? Answering these questions and developing ...

Today, most of the big names in the semiconductor industry are racing into the era of the 3D IC, strapping heterogeneous dies directly on top of each other to improve performance without increasing ...

Thermal management has long been a key challenge facing design engineers. For decades, engineers have faced trying to dissipate heat from densely packed electronics that have continued to shrink in ...

A programming framework could streamline chip design by bridging the gap between conceptual design and practical execution [1]. This may help address the ongoing challenge in the computer hardware ...

In a nutshell: For more than half a century, the relentless progress of Moore's Law has driven engineers to double the number of transistors on a chip approximately every two years, fueling ...