Creating a sensor-based IoT edge device is challenging, due to the multiple design domains involved. But, creating an edge device that combines the electronics using the traditional CMOS IC flow and a ...
CEA-Leti at IEDM 2023 today described the world's-first 3D sequential integration (3DSI) of CMOS over CMOS with advanced metal line levels, which brings 3DSI with intermediate BEOL closer to ...
At the 46th Design Automation Conference in San Francisco last month, attention turned to a discussion of how to extend the momentum of Moore’s Law into the next decade. One plausible solution, ...
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